A mains electricity (AC-powered) device assembly with a high-power (>5mW) optically-pumped semiconductor laser (OPSL) intended for ocular incisions (typically capsulotomy performed during cataract surgery). The laser utilizes a diode/semiconductor chip (as the active medium) to emit a laser beam which is doubled in frequency (e.g., to 590nm). It does not include femtosecond pulsing, or fundus imaging technology.