Primary Device ID | B167T21000001090 |
NIH Device Record Key | 50544787-6bad-46a2-9c91-7a66a212c9c8 |
Commercial Distribution Status | In Commercial Distribution |
Brand Name | CURE 2.0™ ACP |
Version Model Number | T2-10-00001-09 |
Company DUNS | 182698477 |
Company Name | MEDITECH SPINE, LLC |
Device Count | 1 |
DM Exempt | false |
Pre-market Exempt | false |
MRI Safety Status | Labeling does not contain MRI Safety Information |
Human Cell/Tissue Product | false |
Device Kit | false |
Device Combination Product | false |
Single Use | false |
Lot Batch | true |
Serial Number | false |
Manufacturing Date | false |
Expiration Date | false |
Donation Id Number | false |
Contains Natural Rubber Latex | false |
Labeled No Natural Rubber Latex | false |
RX Perscription | true |
OTC Over-The-Counter | false |
Device Issuing Agency | Device ID |
---|---|
HIBCC | B167T21000001090 [Primary] |
KWQ | Appliance, fixation, spinal intervertebral body |
Steralize Prior To Use | true |
Device Is Sterile | false |
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
[B167T21000001090]
Moist Heat or Steam Sterilization
Public Version Status | New |
Device Record Status | Published |
Public Version Number | 1 |
Public Version Date | 2022-02-18 |
Device Publish Date | 2022-02-10 |