Bonding Resin S20B

GUDID D798S20B0

Reliance Bonding Resins are intended for use in direct and indirect bonding of orthodontic brackets and appliances. 20g bottle Bonding resin B.

RELIANCE ORTHODONTIC PRODUCTS INC

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Primary Device IDD798S20B0
NIH Device Record Key5de11bfc-857d-4b1c-a903-3e484603f0cd
Commercial Distribution StatusIn Commercial Distribution
Brand NameBonding Resin
Version Model NumberS20B
Catalog NumberS20B
Company DUNS113170088
Company NameRELIANCE ORTHODONTIC PRODUCTS INC
Device Count1
DM Exemptfalse
Pre-market Exemptfalse
MRI Safety StatusLabeling does not contain MRI Safety Information
Human Cell/Tissue Productfalse
Device Kitfalse
Device Combination Productfalse
Single Usefalse
Lot Batchtrue
Serial Numberfalse
Manufacturing Datefalse
Expiration Datetrue
Donation Id Numberfalse
Contains Natural Rubber Latexfalse
Labeled No Natural Rubber Latexfalse
RX Perscriptiontrue
OTC Over-The-Counterfalse

Customer Support Contacts

Phone630-773-4009
Emailpaulgropi@aol.com
Phone630-773-4009
Emailpaulgropi@aol.com
Phone630-773-4009
Emailpaulgropi@aol.com
Phone630-773-4009
Emailpaulgropi@aol.com
Phone630-773-4009
Emailpaulgropi@aol.com
Phone630-773-4009
Emailpaulgropi@aol.com
Phone630-773-4009
Emailpaulgropi@aol.com
Phone630-773-4009
Emailpaulgropi@aol.com
Phone630-773-4009
Emailpaulgropi@aol.com
Phone630-773-4009
Emailpaulgropi@aol.com
Phone630-773-4009
Emailpaulgropi@aol.com
Phone630-773-4009
Emailpaulgropi@aol.com
Phone630-773-4009
Emailpaulgropi@aol.com
Phone630-773-4009
Emailpaulgropi@aol.com
Phone630-773-4009
Emailpaulgropi@aol.com

Operating and Storage Conditions

Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)
Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)
Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)
Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)
Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)
Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)
Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)
Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)
Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)
Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)
Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)
Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)
Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)
Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)
Special Storage Condition, SpecifyBetween 0 and 0 *TEMPERATURE LIMITATION: Store at room temperature (15-30 ◦C)

Device Identifiers

Device Issuing AgencyDevice ID
HIBCCD798S20B0 [Primary]

FDA Pre-market Approvals/Notifications & deNovo

FDA Product Code

DYHAdhesive, Bracket And Tooth Conditioner, Resin

Sterilization

Steralize Prior To Usefalse
Device Is Sterilefalse

Device Entry Metadata

Public Version StatusUpdate
Device Record StatusPublished
Public Version Number3
Public Version Date2018-07-06
Device Publish Date2016-08-01

On-Brand Devices [Bonding Resin]

D798S7B0Reliance Bonding Resins are intended for use in direct and indirect bonding of orthodontic brack
D798S7AF0Reliance Bonding Resins are intended for use in direct and indirect bonding of orthodontic brack
D798S20B0Reliance Bonding Resins are intended for use in direct and indirect bonding of orthodontic brack
D798S20AF0Reliance Bonding Resins are intended for use in direct and indirect bonding of orthodontic brack

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