HY-BOND 1211B

GUDID E2351211B0

HY-BOND RESIGLASS POWDER 7.5KG (UPI)

SHOFU DENTAL CORPORATION

Glass ionomer dental cement
Primary Device IDE2351211B0
NIH Device Record Key61cf13ca-dc62-4de7-b112-f6d6710e3cd7
Commercial Distribution StatusIn Commercial Distribution
Brand NameHY-BOND
Version Model Number1211B
Catalog Number1211B
Company DUNS054618202
Company NameSHOFU DENTAL CORPORATION
Device Count1
DM Exemptfalse
Pre-market Exemptfalse
MRI Safety StatusLabeling does not contain MRI Safety Information
Human Cell/Tissue Productfalse
Device Kitfalse
Device Combination Productfalse
Single Usefalse
Lot Batchtrue
Serial Numberfalse
Manufacturing Datefalse
Expiration Datetrue
Donation Id Numberfalse
Contains Natural Rubber Latexfalse
Labeled No Natural Rubber Latexfalse
RX Perscriptiontrue
OTC Over-The-Counterfalse

Customer Support Contacts

Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com
Phone+1(800)827-5262
Emailcustomer-service@shofu.com

Device Identifiers

Device Issuing AgencyDevice ID
HIBCCE2351211B0 [Primary]

FDA Pre-market Approvals/Notifications & deNovo

FDA Product Code

EMACEMENT, DENTAL

Sterilization

Steralize Prior To Usefalse
Device Is Sterilefalse

Device Entry Metadata

Public Version StatusNew
Device Record StatusPublished
Public Version Number1
Public Version Date2021-02-11
Device Publish Date2021-02-03

On-Brand Devices [HY-BOND]

E2351212B0HY-BOND RESIGLASS LIQUID 5KG (UPI)
E2351211B0HY-BOND RESIGLASS POWDER 7.5KG (UPI)

Trademark Results [HY-BOND]

Mark Image

Registration | Serial
Company
Trademark
Application Date
HY-BOND
HY-BOND
78641278 3095467 Live/Registered
Shofu, Inc.
2005-06-01
HY-BOND
HY-BOND
76556100 not registered Dead/Abandoned
SHOFU, INC.
2003-10-16
HY-BOND
HY-BOND
74425256 1840278 Dead/Cancelled
SHOFU, INC.
1993-08-16

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