DIO UF HSA Internal Sub-Merged Implant System UF(II) 4015S

GUDID 08806195934333

The DIO UF HSA Internal Sub-Merged Implant System is comprised of Dental Implants, Superstructures, Instruments for prosthetics and Surgical Instruments. The DIO UF HSA Internal Sub-Merged Implant System is specially designed for using in dental implant surgery. A successfully osseointegrated fixtures will achieve a firm implant when the fixture is operated under the controlled conditions per well known clinical studies. There are intended for use in partially or fully edentulous mandibles and maxillae, in support of single or multiple-unit restorations.

DIO Corporation

Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece Screw endosteal dental implant, two-piece
Primary Device ID08806195934333
NIH Device Record Key23d464b2-6247-402e-a4f4-a63a3b564d00
Commercial Distribution Discontinuation2022-02-28
Commercial Distribution StatusIn Commercial Distribution
Brand NameDIO UF HSA Internal Sub-Merged Implant System
Version Model NumberUF(II) 4015S
Catalog NumberUF(II) 4015S
Company DUNS631085206
Company NameDIO Corporation
Device Count1
DM Exempttrue
Pre-market Exemptfalse
MRI Safety StatusLabeling does not contain MRI Safety Information
Human Cell/Tissue Productfalse
Device Kitfalse
Device Combination Productfalse
Single Usetrue
Lot Batchtrue
Serial Numbertrue
Manufacturing Datetrue
Expiration Datetrue
Donation Id Numberfalse
Contains Natural Rubber Latexfalse
Labeled No Natural Rubber Latexfalse
RX Perscriptiontrue
OTC Over-The-Counterfalse

Customer Support Contacts

Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com
Phone213-365-2875
Emailusahq@dioimplantusa.com

Device Dimensions

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Operating and Storage Conditions

Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius
Storage Environment TemperatureBetween 1 Degrees Celsius and 30 Degrees Celsius

Device Identifiers

Device Issuing AgencyDevice ID
GS108806195934333 [Primary]

FDA Pre-market Approvals/Notifications & deNovo

FDA Product Code

DZEImplant, Endosseous, Root-Form

Sterilization

Steralize Prior To Usefalse
Device Is Steriletrue

Device Entry Metadata

Public Version StatusUpdate
Device Record StatusPublished
Public Version Number4
Public Version Date2022-02-16
Device Publish Date2015-10-22

On-Brand Devices [DIO UF HSA Internal Sub-Merged Implant System]

08806195967829ICC 65309N
08806195967812ICC 60649N
08806195967805ICC 48588N
08806195967799ICC 48508N
08806195958926STI 2004
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08806195930076The DIO UF HSA Internal Sub-Merged Implant System is comprised of Dental Implants, Superstructur
08806195930069The DIO UF HSA Internal Sub-Merged Implant System is comprised of Dental Implants, Superstructur
08806195930052The DIO UF HSA Internal Sub-Merged Implant System is comprised of Dental Implants, Superstructur
08806195930038The DIO UF HSA Internal Sub-Merged Implant System is comprised of Dental Implants, Superstructur
08806195930021The DIO UF HSA Internal Sub-Merged Implant System is comprised of Dental Implants, Superstructur
08806195930014The DIO UF HSA Internal Sub-Merged Implant System is comprised of Dental Implants, Superstructur
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08806195930335The DIO UF HSA Internal Sub-Merged Implant System is comprised of Dental Implants, Superstructur
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08806195930311The DIO UF HSA Internal Sub-Merged Implant System is comprised of Dental Implants, Superstructur

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